IPC-TM-650 procedures are available to the public (no charge) on the IPC website.
Don vischulis
-----Original Message-----
>From: "Chezhian, Krishnan (Radhakrishnan)" <[log in to unmask]>
>Sent: Jul 25, 2006 1:05 AM
>To: [log in to unmask]
>Subject: Re: [TN] IPC webcast - Electroplating Technologies - 7/27/06
>
>Hi Huynh,
>
>You could refer to the IPC Specs. TM-650 Section 2.4.24C - Glass
>Transition Temperature & Z-Axis Thermal Expansion by TMA & Section
>2.4.24.1 - Time To Delamination (TMA Method) & Section 2.4.25C - Glass
>Transition Temperature & Cure Factor By DSC. These are IPC specs. so
>cannot be forwarded, need license....
>
>Thanks & Best Regards,
>Krishnan C
>SANMINA-SCI
>
>
>-----Original Message-----
>From: Huynh Thanh Nhan [mailto:[log in to unmask]]
>Sent: Tuesday, July 25, 2006 1:41 PM
>To: TechNet E-Mail Forum; Chezhian, Krishnan (Radhakrishnan)
>Subject: Re: [TN] IPC webcast - Electroplating Technologies - 7/27/06
>
>Dear Mr. Krishnan,
>
>Could you send any document or web site about
>"DSC test to check the Tg of the material to see if it
>fully cured" and "TMA test to see the T260C".
>
>Thanks and best regards,
>Nhan
>
>----- Original Message -----
>From: "Chezhian, Krishnan (Radhakrishnan)"
><[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Tuesday, July 25, 2006 12:19 PM
>Subject: Re: [TN] IPC webcast - Electroplating Technologies - 7/27/06
>
>
>Hi Suresh,
>
>The reason for delamination could be due to various causes. From the
>description given below it is not clear whether you are able to see the
>delamination or "popcorn" effect from the outer layers after your
>outer-layer etch process or the delamination only occurs after the
>boards have been subjected to a thermal excursion like HASL, thermal
>shock, IR reflow or wave-solder process.
>If the delamination is occurring over the copper surface on the
>inner-layers, it is most probably the adhesion between the prepregs &
>oxide-coated copper surface is poor. This could be due to poor or
>insufficient oxide coating or the lamination parameters are not fine
>tuned, so the material is not fully cured. Since you are saying both the
>Isola & Nelco materials exhibit this phenomena, then it is most unlikely
>to be a material issue.
>You could run a DSC test to check the Tg of the material to see if it
>fully cured or perform a TMA test to see the T260C, time to
>delamination. If these numbers appear to be quite low than the vendors
>spec. then you have an issue with the lamination processing parameters.
>If you are seeing the delamination after the boards have been subjected
>to a thermal excursion then there are other factors that would come to
>play, like shelf life & storage conditions of the boards, how long the
>boards have been kept & whether any baking was done prior to subjecting
>to any thermal excursion, moisture absorption due to the hygroscopic
>nature of the FR-4 material. Or if the boards have been subjected to a
>Lead Free process & the laminate material used is not compatible to this
>process etc.,
>Pls provide more details as to the exact occurrence of the delamination
>& we may be able to share more info on this........
>
>Thanks & Best Regards,
>Krishnan C
>SANMINA-SCI
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of T Suresh Babu
>Sent: Tuesday, July 25, 2006 11:53 AM
>To: [log in to unmask]
>Subject: Re: [TN] IPC webcast - Electroplating Technologies - 7/27/06
>
>Dear Friends,
>I am new member for Technet.We are experiencing the delamination in the
>multilayer ten layer and above.We us Isola and Nelco prepeg we are
>experiencing this problem with both materials.The delamination over the
>copper area on innerlayer.We use black oxide for the innerlayer and
>vacuum
>press for lamination.
>Can any one share your experience.
>Regards
>Suresh
>
>----- Original Message -----
>From: "Tina Nerad" <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Tuesday, July 25, 2006 2:39 AM
>Subject: [TN] IPC webcast - Electroplating Technologies - 7/27/06
>
>
>Electroplating technologies, including an overview of the plating
>process and factors affecting plating distribution and throwing power,
>are the topics in this webcast. Don't miss out on this opportunity to
>learn everything you need to know about the electroplating process!
>
>Electroplating Technologies
>July 27th, 2006, 10:00 a.m. - 11:00 .am. (CDT)
>
>To register for this webcast or for more information, visit:
>http://www.ipc.org/calendar/2006/PWB_BasicWebcastSeries_0706/PWBFab_Webc
>astSeries_706.htm
>
>Following this webcast, IPC is hosting an in-depth workshop covering
>every aspect of the PCB Manufacturing Process:
>
>August 2, 2006, 8:00 a.m. - 4:30 p.m.
>Bannockburn, IL
>Instructor: Michael Carano
>Electrochemicals, Inc.
>
>To register for this workshop or for more information, visit:
>http://www.ipc.org/calendar/2006/AdvTroubleshooting_0806/Advtroubleshoti
>ng_806.htm
>
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