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Subject:	AW: [TN] osp over gold bond pads
From:	Kruschitz Herbert <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Kruschitz Herbert <[log in to unmask]>
Date:	Mon, 10 Jul 2006 08:26:44 +0200
Content-Type:	text/plain
Parts/Attachments:	text/plain (69 lines)

Hi Cheryl
Our plating shop uses 

Entek Plus 106 A ( X )

which goes only onto copper and not an Au, Sn and other metal surfaces.
Our customers are successfull using such kind of boards.


--
Herbert W. Kruschitz
QSM (EOQ)
Senior Project Manager 

OPTIPRINT AG
Auerstr. 37
CH-9442 Berneck 

Tel :   +41 (0)71 747 86 27 
Cell:   +41 (0)79 614 74 56 
Fax :   +41 (0)71 747 86 87 
Mail:   mailto:[log in to unmask] 
URL:    www.optiprint.ch 

 
-----Ursprüngliche Nachricht-----
Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Cheryl Johnson
Gesendet: Donnerstag, 6. Juli 2006 20:42
An: [log in to unmask]
Betreff: [TN] osp over gold bond pads

Does any one have any experience they care to share with OSP over electroplated gold bond pads (on FLEX)?
It would save us 5 cents each if the gold pads didn't have to be masked before the OSP is applied...
Thank you for your help!
Sincerely,

-----------------------------------

Cheryl Johnson, C.I.D.+

Manager

ExcelStor US Office, Engineering Services

Email: [log in to unmask]

Tel: (303) 684-7291

Fax: (303) 684-7268

Mobile: (303) 809-5815

-----------------------------------


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