Hello fellow Technetters,

Would like some advise from the experts out there.

We have always assembled pcb with minimal solder balls that usually gets 
washed away in the cleaning process, hence not creating any major problems.
However, recently we have been getting involve with more complex boards that  
has alot of 1mm and .8mm low profile bga's.
The problem that we are noticing is that the solder balls that never was a 
problem before are now getting stuck under the bga's, sometimes creating shorts. 
I am not sure if we can eliminate solder balls completely but would 
like to know how the experts are resolving a problem of this sort.

Thanks in advance for your input.
Regards,
Carl Beharry 
Ectronics, Inc.
855 Industrial Hwy
Cinnaminson, NJ 08077
Phone : (856) 829-7161
Fax : (856) 829-6950
Email : [log in to unmask]
  




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