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July 2006

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
Date:
Fri, 7 Jul 2006 08:50:25 -0400
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Some of OSP decomposed at soldering temperature completely, however, if the
OSP decomposition product left on the gold bonding pad as graphitic layer,
the bonding still going to be impacted (depend what you bond... if that is
big wire of 2 mils, you might not have problem, if you use 0.7 mil wire, you
sure would at least see the yield impact, unless you have different trick in
your sleeve...).
Some of other OSP always leave residue, some of them suppose to become
"encapsulation like inert" material after soldering... if that is what you
use, you can forget the 6 sigma wire bonding...
                                                        jk (my 1.8 cents)

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of R Sedlak
Sent: Thursday, July 06, 2006 7:57 PM
To: [log in to unmask]
Subject: Re: [TN] osp over gold bond pads

My understanding of the mechanism of OSP has it that gold should be
impervious to any reaction with OSP, or any of the pretreatment chemicals.
Because of this, I can see no reason to mask gold when applying OSP.

But, don't take my word for it, test it.. try making a couple of boards with
unmasked gold, and sending them through OSP... and test the results.

And let us know what happens.

Rudy Sedlak
RD Chemical Company

Cheryl Johnson <[log in to unmask]> wrote: Does any one have
any experience they care to share with OSP over
electroplated gold bond pads (on FLEX)?
It would save us 5 cents each if the gold pads didn't have to be masked
before the OSP is applied...
Thank you for your help!
Sincerely,

-----------------------------------

Cheryl Johnson, C.I.D.+

Manager

ExcelStor US Office, Engineering Services

Email: [log in to unmask]

Tel: (303) 684-7291

Fax: (303) 684-7268

Mobile: (303) 809-5815

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