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| Date: | Thu, 6 Jul 2006 21:58:43 -0400 |
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I'm ashamed to say that indeed, I have done very similar constructs.
It can be made reliable, but you better have a REAL GOOD REASON! Keep in mind that that the TCE differential will likely mean posting (the wire will poke up above level after lamination. If the layers are thin enough, you can get away with it, but if the layers are too thick, the plating can tear away from the surface layers after a reflow cycle. The wire must be placed by hand, and a planarization step has to take place before plating that layer subset.
Wouldn't you really rather have a heavy plating on the via, and conductive via fill if its conductivity you're after?
Wayne Thayer
EDO Corp
443-542-2632
>>> [log in to unmask] >>>
Has anyone ever heard about burying an 14 AWG wire from layer 7 to 10 on a
12 layer board?
Sounds painful doesn't it?
Any help would be appreciated.
Regards,
Deac
Deac Descôteaux
KAW USA, LTD.
39 Simon St. Bldg.#4
Nashua, NH 03060
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