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July 2006

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Subject:
From:
R Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:
Thu, 6 Jul 2006 16:57:27 -0700
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My understanding of the mechanism of OSP has it that gold should be impervious to any reaction with OSP, or any of the pretreatment chemicals.
Because of this, I can see no reason to mask gold when applying OSP.

But, don't take my word for it, test it.. try making a couple of boards with unmasked gold, and sending them through OSP... and test the results.

And let us know what happens.

Rudy Sedlak
RD Chemical Company

Cheryl Johnson <[log in to unmask]> wrote: Does any one have any experience they care to share with OSP over
electroplated gold bond pads (on FLEX)?
It would save us 5 cents each if the gold pads didn't have to be masked
before the OSP is applied...
Thank you for your help!
Sincerely,

-----------------------------------

Cheryl Johnson, C.I.D.+

Manager

ExcelStor US Office, Engineering Services

Email: [log in to unmask]

Tel: (303) 684-7291

Fax: (303) 684-7268

Mobile: (303) 809-5815

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