Hi, Joe.
The best place to start is with the component manufacturer's recommended
profile. On nearly all component prints or data sheets, there is usually
a recommended profile. While not all of these profiles are always
optimum, they are usually a good place to start.
When setting up the reflow process or wave solder process for the first
time for a new product, I always go through ALL of the component prints
to make sure there are no special requirements as far as
time/temperature limits. I have seen too many people find out too late
that they had parts that would not withstand "normal" soldering
processes. Some components have a very small process window. Sometimes
you do not find out until it is too late, ie., the parts passed
electrical test but fail later because they were overstressed during
manufacturing processes.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Macko, Joe @ IEC
Sent: Monday, July 31, 2006 2:15 PM
To: [log in to unmask]
Subject: [TN] Recommended smt SnPb solder reflow profile temperature
ramp rates

Hello Fellow Tech,



Can someone please tell me which IPC, J-STD or JEDEC type documents
callout recommended smt SnPb reflow temperature "ramp rates"? I found
some info in J-STD-020 but this is for the package temperature and not
solder.  I suspect the best source of this info is the solder paste
manufacturer's tech data sheet but just wanted to see if IPC has some
guidelines.



Thanks again

Joe




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