Hello Fellow Tech,



Can someone please tell me which IPC, J-STD or JEDEC type documents callout
recommended smt SnPb reflow temperature "ramp rates"? I found some info in
J-STD-020 but this is for the package temperature and not solder.  I suspect
the best source of this info is the solder paste manufacturer's tech data
sheet but just wanted to see if IPC has some guidelines.



Thanks again

Joe




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