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July 2006

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Subject:
From:
Chris Ball <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 6 Jul 2006 09:48:39 -0400
Content-Type:
text/plain
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text/plain (94 lines)
Maybe both? I think my Ma always wanted me to marry you.

-Chris





                       Barbara Burcham
                       <[log in to unmask]>          To:   [log in to unmask]
                       Sent by: TechNet                  cc:
                       <[log in to unmask]>                 Subject:    [TN] Validy of Teardropped vias?

                       07/06/2006 09:17 AM
                       Please respond to TechNet
                       E-Mail Forum; Please
                       respond to Barbara Burcham









Hey Y'all,



It is my habit to teardrop a trace coming into a through-hole pad if the
trace is 5 mils or less and the annular ring of the pad is 5 mils or
less.

Does this improve manufacturability of the bare board, protect against
drill-out, and fracturing of the point where the trace enters the pad
under shock and vibration?

Or am I an old-fashioned girl?





Barbara Burcham, C.I.D.

Sr. PCB Designer

RFTrax a Fairfield Co.

[log in to unmask]

281-276-5916

281-276-5950 fax




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