We have a PCBA assembly that requires very low/none ionic
contamination due
to high impedance circuitry. Normally we use a water soluble flux solder
paste and wash
the PCBAs. Our current vendor only uses Indium NC-SMQ92 no-clean solder
paste. To met
the following spec:
Printed Circuit Assemblies shall meet cleanliness standards as per
IPC-A-610 and IPC/EIA J-STD-001.
Testing shall be in accordance with and meet the requirements of IPC/EIA
J-STD-001 Paragraph 8.3.6 or 8.3.7.
they want to use water and Kyzen XJN+ as a saponifier. Has anyone used
this method of cleaning
a no clean assembly? If so what was the result? Any other suggestions?
Thank you.
Best Regards,
Michael Forrester
Sr. Manufacturing Engineer
LeCroy Corp
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------