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July 2006

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Subject:
From:
Michael Forrester <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 26 Jul 2006 16:15:07 -0400
Content-Type:
text/plain
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text/plain (34 lines)
      We have a PCBA assembly that requires very low/none ionic
contamination due
to high impedance circuitry.  Normally we use a water soluble flux solder
paste and wash
the PCBAs.  Our current vendor only uses Indium NC-SMQ92 no-clean solder
paste.  To met
the following spec:

Printed Circuit Assemblies shall meet cleanliness standards as per
IPC-A-610 and IPC/EIA J-STD-001.
Testing shall be in accordance with and meet the requirements of IPC/EIA
J-STD-001 Paragraph 8.3.6 or 8.3.7.

they want to use water and Kyzen XJN+ as a saponifier.  Has anyone used
this method of cleaning
 a no clean assembly?  If so what was the result?  Any other suggestions?
Thank you.

Best Regards,

Michael Forrester
Sr. Manufacturing Engineer
LeCroy Corp

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