Advanced Troubleshooting the PCB Manufacturing Process
August 2, 2006 - Bannockburn, IL
Instructor: Michael Carano, Electrochemicals, Inc.
This course will address advanced problem solving of printed wiring
board defects, and the following topics will be discussed:
* Lamination and other multilayer related defects
* Solderability and assembly issues
* Electrodeposition defects: mouse bites, pitting, nodules, crown or
dome plating, dog bone defects
* Why assemblers want to blame the fabricators for defects
* Copper plating reliability
* Black pad phenomenon: new details on its cause and how to eliminate it
* How to improve plating distribution and throwing power
* Imaging: defects, surface preparation, soldermask issues and defects,
process control
* Metallization: microvoids/voiding, interconnect separation, hole wall
pullaway, glass coverage, metallizing high performance resins, wedge
voids
For more information on this workshop, please cut and paste the
following into your browser:
http://www.ipc.org/calendar/2006/AdvTroubleshooting_0806/Advtroubleshoti
ng_806.htm.
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