Hi Peer,

Who could i contact to get some spec or samples?

Ted Kong

--- "P. Langeveld" <[log in to unmask]> wrote:

> Dear Joe,
>
> 3M company has Z-conductive anisotropix tape that
> can be used for
> temporarily use to test components.
>
> Peer Langeveld
> Consultant Soft Soldering Processes
> 5502 VH 8  NL
>
>
> 2006/7/20, Stadem, Richard D.
> <[log in to unmask]>:
> > Joe,
> > I did not see your note about test sockets not
> being an option. So here
> > is another method of temporary attachment.
> > If the pwb has holes in it for heatsink clamping
> onto the BGA, use them
> > to clamp a small aluminum bar across the top of
> the BGA. The process
> > goes like this:
> >        1. Start with a clean dry circuit board.
> Place the BGA
> > ball-side-down on a small       flat piece of tool
> steel and gently rub
> > back and forth while applying a light   pressure.
> This will create a
> > flat spot on the bottom of the solder balls. When
>      each solder ball
> > has a small flat spot you know they will all make
> contact with the
> > pwb pads later.
> >        2. Apply a very, very light coat of tacky
> flux to the pads to
> > help hold the BGA in    place. Do not get the flux
> outside of the BGA
> > body perimeter.
> >        3. Place the board into your rework
> machine, pick it up with the
> > vacuum, and align       the BGA to the pads and
> place it as if you were
> > going to do a rework. Use a nozzle      much
> smaller than the component
> > body.
> >        4.Place the part onto its pads, but leave
> the nozzle down on the
> > part. Using ESD-        safe masking tape, tape
> the four sides of the
> > BGA down but leave the holes in the     PWB clear.
> >        5. Lift the nozzle. Remove the board. Place
> the aluminum bar on
> > the top of the BGA      and gently tighten the
> screws/nuts to clamp the
> > BGA to the pads.
> >        6. X-ray to verify the alignment. Check the
> polarity as well.
> >        7. Gently wash the board to remove the
> flux.
> >        8. Power up and see the cool blue
> sparks/corona/smoke under the
> > BGA (just kidding).
> >
> > If the pwb does not have any mounting holes, epoxy
> two pemnuts to the
> > pwb on each side of the BGA pattern to use as
> screw retainers. Use SMT
> > epoxy, it can be gently chipped off after you are
> finished. You can heat
> > it up slightly for easier removal without any harm
> to the pwb.
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf
> Of Macko, Joe @ IEC
> > Sent: Thursday, July 20, 2006 12:16 PM
> > To: [log in to unmask]
> > Subject: [TN] temporary attachment of a BGA to a
> PCB for test
> >
> > Fellow techs,
> >
> >
> >
> > I have been asked to determine if there is a way
> to temporarily install
> > a BGA onto a test board using some type of
> conductive adhesive to make
> > electrical contact, electrical test and then
> safely remove the adhesive
> > without damaging the solder balls and be able to
> use the BGA.
> >
> >
> >
> > Sounds impossible but I informed the design group
> I would check out the
> > options.
> >
> >
> >
> > The other option we are looking at is to design a
> clamp/pallet that will
> > securely hold the BGA to the board.  The problem
> here may be making 100%
> > electrical contact on all 48 balls.
> >
> >
> >
> > Anyone have any creative ideas they would like to
> share? Test sockets
> > are not an option.
> >
> >
> >
> >
> >
> > thanks
> >
> > Joe
> >
> >
> >
> >
> >
> >
> >
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