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July 2006

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Subject:
From:
Kevin Glidden <[log in to unmask]>
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Date:
Tue, 25 Jul 2006 13:07:46 -0400
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Hello everyone,
I have heard of stencils that are made much thicker than normal to allow
machined clearances for leads of TH components mounted on the opposite side
of the PCB.   Has anyone succesfully used this technique?  If so, are there
some recommended guidelines? I can imagine there are limitations on pitch
size..
TIA.
Kevin Glidden
Mfg Eng
Luminescent Systems Inc.


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