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July 2006

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Subject:
From:
"Chezhian, Krishnan (Radhakrishnan)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Chezhian, Krishnan (Radhakrishnan) <[log in to unmask]>
Date:
Tue, 25 Jul 2006 13:19:27 +0800
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Hi Suresh,

The reason for delamination could be due to various causes. From the
description given below it is not clear whether you are able to see the
delamination or "popcorn" effect from the outer layers after your
outer-layer etch process or the delamination only occurs after the
boards have been subjected to a thermal excursion like HASL, thermal
shock, IR reflow or wave-solder process.
If the delamination is occurring over the copper surface on the
inner-layers, it is most probably the adhesion between the prepregs &
oxide-coated copper surface is poor. This could be due to poor or
insufficient oxide coating or the lamination parameters are not fine
tuned, so the material is not fully cured. Since you are saying both the
Isola & Nelco materials exhibit this phenomena, then it is most unlikely
to be a material issue. 
You could run a DSC test to check the Tg of the material to see if it
fully cured or perform a TMA test to see the T260C, time to
delamination. If these numbers appear to be quite low than the vendors
spec. then you have an issue with the lamination processing parameters.
If you are seeing the delamination after the boards have been subjected
to a thermal excursion then there are other factors that would come to
play, like shelf life & storage conditions of the boards, how long the
boards have been kept & whether any baking was done prior to subjecting
to any thermal excursion, moisture absorption due to the hygroscopic
nature of the FR-4 material. Or if the boards have been subjected to a
Lead Free process & the laminate material used is not compatible to this
process etc., 
Pls provide more details as to the exact occurrence of the delamination
& we may be able to share more info on this........

Thanks & Best Regards,
Krishnan C
SANMINA-SCI


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of T Suresh Babu
Sent: Tuesday, July 25, 2006 11:53 AM
To: [log in to unmask]
Subject: Re: [TN] IPC webcast - Electroplating Technologies - 7/27/06

Dear Friends,
I am new member for Technet.We are experiencing the delamination in the
multilayer ten layer and above.We us Isola and Nelco prepeg we are
experiencing this problem with both materials.The delamination over the
copper area on innerlayer.We use black oxide for the innerlayer and
vacuum
press for lamination.
Can any one  share your experience.
Regards
Suresh

----- Original Message -----
From: "Tina Nerad" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, July 25, 2006 2:39 AM
Subject: [TN] IPC webcast - Electroplating Technologies - 7/27/06


Electroplating technologies, including an overview of the plating
process and factors affecting plating distribution and throwing power,
are the topics in this webcast. Don't miss out on this opportunity to
learn everything you need to know about the electroplating process!

Electroplating Technologies
July 27th, 2006, 10:00 a.m. - 11:00 .am. (CDT)

To register for this webcast or for more information, visit:
http://www.ipc.org/calendar/2006/PWB_BasicWebcastSeries_0706/PWBFab_Webc
astSeries_706.htm

Following this webcast, IPC is hosting an in-depth workshop covering
every aspect of the PCB Manufacturing Process:

August 2, 2006, 8:00 a.m. - 4:30 p.m.
Bannockburn, IL
Instructor:  Michael Carano
Electrochemicals, Inc.

To register for this workshop or for more information, visit:
http://www.ipc.org/calendar/2006/AdvTroubleshooting_0806/Advtroubleshoti
ng_806.htm

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