I don't feel it is needed any more than perhaps a 'guideline'. I also use
6012 and feel it addresses 99% of the technology (via, bga, etc, etc)
requirements for product we fabricate.

I say send it to that file where IPC 6014 is kept... Anyone remember IPC
6014? I actually say a drawing with IPC 6014 referenced this past week.
Interestingly enough it was not for any type PCMCIA card at all, it was a
type. So for all those type cards we've built, they all required IPC 6012
(which adequately covered all criteria).

This is my opinion.

Franklin

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Susan Mansilla
Sent: Thursday, July 20, 2006 1:50 PM
To: [log in to unmask]
Subject: [TN] 6016 and 6012

This is in reply to Dennis Fritz's question reqarding 6016.  I have always
been puzzled by this document.  I know it's intentions, however it does
require
5 Thermal Stress Cycles at 500F, Except where prohibited by the number of
Stress Cycles and Temp for the entire board.  So, any micro via on a board
with
through holes will receive only one Thermal Stress Test Cycle at 550F.

There is a requirement that there can be only 50% contact between the
plating
and the target land area, that is pretty controversial.

There is an allwed 180 degree breakout allowed for misregistration to the
target contact area that would be a nightmare to evaluate.

There is a set of criteria for blind microvias <15 um in 6012 that tracks
with the copper plating in 6016 - so that is good.

We see many, many drawings that have microvias that do not invoke 6016.

Does the industry believe IPC-6016 is needed or are the attributes
adequately
addressed in IPC-6012???

Susan Hott
Robisan Lab

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