This is in reply to Dennis Fritz's question reqarding 6016.  I have always
been puzzled by this document.  I know it's intentions, however it does require
5 Thermal Stress Cycles at 500F, Except where prohibited by the number of
Stress Cycles and Temp for the entire board.  So, any micro via on a board with
through holes will receive only one Thermal Stress Test Cycle at 550F.

There is a requirement that there can be only 50% contact between the plating
and the target land area, that is pretty controversial.

There is an allwed 180 degree breakout allowed for misregistration to the
target contact area that would be a nightmare to evaluate.

There is a set of criteria for blind microvias <15 um in 6012 that tracks
with the copper plating in 6016 - so that is good.

We see many, many drawings that have microvias that do not invoke 6016.

Does the industry believe IPC-6016 is needed or are the attributes adequately
addressed in IPC-6012???

Susan Hott
Robisan Lab

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