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July 2006

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Thu, 20 Jul 2006 10:53:40 -0700
Content-Type:
text/plain
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text/plain (78 lines)
On the first option I would say no - it would be like trying to glue to
soap.

On the second option you could get continuity by using a square of z avis
conductive elastomer under the bga and clamp down on that.

Whats wrong with a socket though?? (apart from lead time and price??)

John

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Macko, Joe @ IEC
Sent: Thursday, July 20, 2006 10:16 AM
To: [log in to unmask]
Subject: [TN] temporary attachment of a BGA to a PCB for test

Fellow techs,



I have been asked to determine if there is a way to temporarily install a
BGA onto a test board using some type of conductive adhesive to make
electrical contact, electrical test and then safely remove the adhesive
without damaging the solder balls and be able to use the BGA.



Sounds impossible but I informed the design group I would check out the
options.



The other option we are looking at is to design a clamp/pallet that will
securely hold the BGA to the board.  The problem here may be making 100%
electrical contact on all 48 balls.



Anyone have any creative ideas they would like to share? Test sockets are
not an option.





thanks

Joe






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