How about running your tests and then have the BGA reballed?


Danielle L. Casha


        -----Original Message-----
        From:   TechNet [SMTP:[log in to unmask]] On Behalf Of Macko, Joe @ IEC
        Sent:   Thursday, July 20, 2006 1:16 PM
        To:     [log in to unmask]
        Subject:        [TN] temporary attachment of a BGA to a PCB for test

        Fellow techs,



        I have been asked to determine if there is a way to temporarily install a
        BGA onto a test board using some type of conductive adhesive to make
        electrical contact, electrical test and then safely remove the adhesive
        without damaging the solder balls and be able to use the BGA.



        Sounds impossible but I informed the design group I would check out the
        options.



        The other option we are looking at is to design a clamp/pallet that will
        securely hold the BGA to the board.  The problem here may be making 100%
        electrical contact on all 48 balls.



        Anyone have any creative ideas they would like to share? Test sockets are
        not an option.





        thanks

        Joe






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