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July 2006

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Subject:
From:
Scott Decker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Scott Decker <[log in to unmask]>
Date:
Thu, 20 Jul 2006 10:30:13 -0700
Content-Type:
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text/plain (82 lines)
Joe,
   I don't have the details, but I'm pretty sure you can get a socket
with spring points, to test BGA's like I think you want to do? The
springs make the contact comply to the ball no mater the difference in
size, etc. A note though, they can be $$$ depending on size/contacts and
number of cycles, etc. I'm sure you can search for BGA sockets and find
several. Good luck.
Later...

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Macko, Joe @ IEC
Sent: Thursday, July 20, 2006 10:16 AM
To: [log in to unmask]
Subject: [TN] temporary attachment of a BGA to a PCB for test

Fellow techs,



I have been asked to determine if there is a way to temporarily install
a
BGA onto a test board using some type of conductive adhesive to make
electrical contact, electrical test and then safely remove the adhesive
without damaging the solder balls and be able to use the BGA.



Sounds impossible but I informed the design group I would check out the
options.



The other option we are looking at is to design a clamp/pallet that will
securely hold the BGA to the board.  The problem here may be making 100%
electrical contact on all 48 balls.



Anyone have any creative ideas they would like to share? Test sockets
are
not an option.





thanks

Joe






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