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July 2006

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Subject:
Re: Validy of Teardropped vias?
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Thu, 6 Jul 2006 08:34:27 -0500
Content-Type:
text/plain
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text/plain (66 lines) 
Yes to all questions. Take that as a compliment. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Barbara Burcham
Sent: Thursday, July 06, 2006 8:17 AM
To: [log in to unmask]
Subject: [TN] Validy of Teardropped vias?

 

Hey Y'all,

 

It is my habit to teardrop a trace coming into a through-hole pad if the
trace is 5 mils or less and the annular ring of the pad is 5 mils or
less.

Does this improve manufacturability of the bare board, protect against
drill-out, and fracturing of the point where the trace enters the pad
under shock and vibration?

Or am I an old-fashioned girl?

 

 

Barbara Burcham, C.I.D.

Sr. PCB Designer

RFTrax a Fairfield Co.

[log in to unmask]

281-276-5916

281-276-5950 fax

 


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