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July 2006

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Subject:
From:
Dennis Fritz <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 19 Jul 2006 19:35:40 EDT
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I have not followed all the postings on this topic, but have a  question
about where what standard applies.

About 5 years ago, IPC committees completed performance (6016) and  materials
(4104?) standards on "microvias".  In addition, there is a  design guideline
(2226).  The assumption, I believe, was that holes 150  microns or less, were
"microvias".  These documents were stated to pertain  only to the layers with
"microvias".   Otherwise, 6012 pertains to the  other layers. Of course, the
thought then was that sequentially added layers on  the outside of a standard
core board was what the standards meant.   However, there may be interpretation
that small, laser drilled internal layers  also pertain.

Guess I need a clarification as to where each standard applies here in  2006.

Denny Fritz
MacDermid, Inc

*******************************
In a message dated 7/18/2006 10:07:53 P.M. Eastern Daylight Time,
[log in to unmask] writes:

Thanks  Wayne and Yehuda.

Specifically, these are sequential lamination blind  vias.  I wanted
reaffirmation of my interpretation of 6012 internal  annular ring as applied
to the different types of holes, which you have  provided.

Regards,
Jay




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