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July 2006

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From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Wed, 19 Jul 2006 12:32:42 -0500
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The ICT test techs that I asked this question to stated that generally
the IAg finish provides superior contact conductance over both solder
and especially OSP, which I think we all take for granted. However, they
cannot say for sure if the same is true of a tarnished silver surface,
stating they have never had to deal with that problem, at least not that
they were aware of. Anyone else have this problem? 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, July 19, 2006 11:26 AM
To: [log in to unmask]
Subject: Re: [TN] Immersion Silver for ICT

Me too,

I know that silver oxide is conductive, but I do not think that the
sulphides are.

I have always printed them with solder to avoid cosmetic problems
downstream, and also as a wear surface where card guides are a factor
and the contact is used as an EMI earthing point, although in this
latter instance it is wise to break up the earthing card guide edge
ground into a dot pattern and cover the rest with solder resist.

John

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Darrel Therriault
Sent: Wednesday, July 19, 2006 8:57 AM
To: [log in to unmask]
Subject: Re: [TN] Immersion Silver for ICT

Leo,

I always included test pads in my solder stencil so they would be
soldered.

DJT



Lin Leo <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
07/19/2006 12:04 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to Lin Leo
<[log in to unmask]>


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Subject
[TN] Immersion Silver for ICT






Hi,

  Recently, I met a customer complaint for Immersion Ag boards.
Immersion Ag  boards in assembly side weren't applied solder on ICT(in
circuit test) pads.  After assembly, Ag surface discoloration problem
and ICT failure defect were found in those pads.  Those pad were still
solderable.  ICT was OK after soldering.  Does anyone have similar
experience?  How can I solve this problem?  Does it need to suggest
pre-solder before ICT?  It's chronic or excursion issue for immersion Ag
surface finish?

  Best regards

  Leo

 ___________________________________________________
 ??? Yahoo!?????? 7.0???????????

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