Subject: | |
From: | |
Reply To: | |
Date: | Wed, 19 Jul 2006 09:25:46 -0700 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Me too,
I know that silver oxide is conductive, but I do not think that the
sulphides are.
I have always printed them with solder to avoid cosmetic problems
downstream, and also as a wear surface where card guides are a factor and
the contact is used as an EMI earthing point, although in this latter
instance it is wise to break up the earthing card guide edge ground into a
dot pattern and cover the rest with solder resist.
John
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Darrel Therriault
Sent: Wednesday, July 19, 2006 8:57 AM
To: [log in to unmask]
Subject: Re: [TN] Immersion Silver for ICT
Leo,
I always included test pads in my solder stencil so they would be
soldered.
DJT
Lin Leo <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
07/19/2006 12:04 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Lin Leo <[log in to unmask]>
To
[log in to unmask]
cc
Subject
[TN] Immersion Silver for ICT
Hi,
Recently, I met a customer complaint for Immersion Ag boards. Immersion
Ag boards in assembly side weren't applied solder on ICT(in circuit test)
pads. After assembly, Ag surface discoloration problem and ICT failure
defect were found in those pads. Those pad were still solderable. ICT
was OK after soldering. Does anyone have similar experience? How can I
solve this problem? Does it need to suggest pre-solder before ICT? It's
chronic or excursion issue for immersion Ag surface finish?
Best regards
Leo
___________________________________________________
??? Yahoo!?????? 7.0???????????
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
http://messenger.yahoo.com.tw/
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|