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July 2006

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Subject:
From:
Darrel Therriault <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 19 Jul 2006 08:56:32 -0700
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Leo,

I always included test pads in my solder stencil so they would be
soldered.

DJT



Lin Leo <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
07/19/2006 12:04 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Lin Leo <[log in to unmask]>


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Subject
[TN] Immersion Silver for ICT






Hi,

  Recently, I met a customer complaint for Immersion Ag boards.  Immersion
Ag  boards in assembly side weren't applied solder on ICT(in circuit test)
pads.  After assembly, Ag surface discoloration problem and ICT failure
defect were found in those pads.  Those pad were still solderable.  ICT
was OK after soldering.  Does anyone have similar experience?  How can I
solve this problem?  Does it need to suggest pre-solder before ICT?  It's
chronic or excursion issue for immersion Ag surface finish?

  Best regards

  Leo

 ___________________________________________________
 ??? Yahoo!?????? 7.0???????????

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