REGISTRATION IS UNDERWAY!
 
Flexible circuitry and chip scale packaging (CSP) are the major topics for this conference, held in Minneapolis, MN on July 24-25, 2006. New designs, materials and applications appear on a regular basis. Don't miss this opportunity to find out everything you need to know about flex circuits, and chip scale packaging.

Please cut and paste the following into your browser for more information:
http://www.ipc.org/calendar/2006/FlexCSP_706/FlexCSPConf_0706.htm

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