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July 2006

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Subject:
Last Chance to Register for the IPC International Flex and Chips Conference
From:
Nate Fitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Nate Fitt <[log in to unmask]>
Date:
Mon, 17 Jul 2006 14:28:24 -0500
Content-Type:
text/plain
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text/plain (65 lines) 
 

 

New designs and applications are constantly being developed for flexible
circuitry and chip scale packaging (CSP) technologies, and it's
essential to stay on top of these changes. IPC has assembled a lineup of
industry experts to speak at the International Conference on Flexible
Circuits and Chip Scale Packaging on July 24-25, 2006, in Minneapolis,
Minn. 

 

This two day event, including workshops and a technical conference
covering the basics of flexible circuitry, IC packaging, defect free
fabrication and design, is where you need to be.

 

Visit www.ipc.org/flexnchips for a full conference agenda and set of
course descriptions. The one-day conference will take place on July 25. 

 

Educational Courses - July 24, 2006:

 

The Complete Guide to Flexible Circuitry: Materials, Processes &
Packaging - 8:30am-4:30pm - Instructed by Ken Gilleo, Ph.D., ET-Trends
LLC

 

Advanced Packaging Technologies and Future Trends - 8:30am-11:30am -
Instructed by Joe Fjelstad, Silicon Pipe, Inc.

 

Advanced Troubleshooting for Printed Wiring Board Manufacturing - Defect
Analysis and Prevention 8:30am-11:30am - Instructed by Michael Carano,
Electrochemicals, Inc.

 

Flexible Circuit Design Principles and Fabrication Requirements -
1:00pm-4:00pm - Vern Solberg, Micro Electronic Engineering Services

 

Key Aspects of Desmear, Metallization and Electroplating of Flexible
Circuits - 1:00pm-4:00pm - Instructed by Michael Carano,
Electrochemicals, Inc.


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