No. On the parts that you are currently using the unused ball will
simply reflow and re-solidify to its BGA pad. It should not be a
problem. I would not attempt to remove the unused ball from the BGA
beforehand, just leave it be.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Black, Paul
Sent: Monday, July 17, 2006 11:03 AM
To: [log in to unmask]
Subject: [TN] BGA Pad Missing on Board

Hi Everyone,

I have a quick question on BGA's. I have a board that is laid out for a
BGA that the manufacturer is still developing. In the meantime, it can
be populated with a different BGA from the same manufacturer and
functionally it works fine. My problem is that the board layout has a
location where there is no BGA pad. The newer part has no ball in that
area but the one I am currently using does have a ball there. Are there
any potential problems of having a BGA ball reflowing but not having a
pad to bond with?

Thank you,
Paul Black
Manufacturing Engineer
Kronos 

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