Hi Everyone,

I have a quick question on BGA's. I have a board that is laid out for a BGA that the manufacturer is still developing. In the meantime, it can be populated with a different BGA from the same manufacturer and functionally it works fine. My problem is that the board layout has a location where there is no BGA pad. The newer part has no ball in that area but the one I am currently using does have a ball there. Are there any potential problems of having a BGA ball reflowing but not having a pad to bond with?

Thank you, 
Paul Black 
Manufacturing Engineer 
Kronos 

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------