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July 2006

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Subject:
SAC105 BGA ball
From:
don_well <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, don_well <[log in to unmask]>
Date:
Thu, 6 Jul 2006 12:00:25 +0800
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Hi All

> 

>   I recently faced a issues of lead-free BGA.

>   We use Qualcomm ICs in our productions. Recently Qualcomm change BGA balls material from SAC305 to SAC105.The melting point update to 227 degree.

>   Could you please tell me which alloy paster should be used, SAC305 or other special? Any treatment should be made to the reflow profile? Does anyone tell me what is the advancement for SAC105 alloy?

> 

> Thanks in advance.

> 

> Don Well

> Huawei Technologies Co,. Ltd

>

µç»°£º0755-89651109

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