Phew... the stripping issues you generate doing this must be incredible.
We had a photoresist stripper we dubbed "MND"... for "Minor Nuclear Device".
Sounds like you would need it after this treatment...
Rudy Sedlak
RD Chemical Company
Jeffrey Bush <[log in to unmask]> wrote: You can also do a 170F/15 Min bump in an oven to improve adhesion of DF to copper.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice - 802.257.4571 ext 21
Fax - 802.257.0011
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of R Sedlak
Sent: Thursday, July 13, 2006 10:57 AM
To: [log in to unmask]
Subject: Re: [TN] Surface Roughness
Yusef Gimec:
You bring up an interesting question. With more modern dryfilm, it has been shown unnecessary for the copper to be roughened at all... in fact there is a related industry, the photochemical machining industry, which makes lead frames, which cannot tolerate any roughening, and uses dryfilms for etching copper. We have developed cleaners for this industry, which clean the copper, but leave it shiney, and the dryfilm adheres very well.
This ability to bond to a smooth surface may vary with the dryfilm, but we have yet to find a film which does not bond very well to a properly cleaned smooth surface.
The key issue we find is to clean the copper, dry, and bond the dryfilm immediately, with no hold time between any of the steps.
I suspect that your dryfilm supplier may be looking for excuses to blame the problems you are having, and they do not really understand the issue.
Rudy Sedlak
RD Chemical
Baski Devre wrote:
Dear Technetter
To gain best bonding of dry film to the base material some of the
parameters must be controlled strictly such as temperature of rollers of
laminator or sodium carbonate and may be the most critical parameter is
surface roughness. Our dry film supplier suggest roughness value for Rz
1,5 - 3 microns for Ra 0,15 -0 ,3 microns. I want to have your comments
if Rz is normal I mean between 1,5 and 3 microns let us say Rz is 2.10
and Ra is 0.41 microns, how can we interprete or comment on these value;
does it bring good bonding with it or it is an obstacke for dry film to
bond to surface
Thanks in advance for your interpretations and knowledge share
Best Regards
--
Yusuf GÖMEÇ
Product Quality Engineer
BASKI DEVRE SAN ve TIC LTD STI
Ceyhan Sk. No:10 34896 Pendik-Istanbul-Turkey
Tel: 00 90 216 3901036 (4 Hat/Line)-173(Extention)
00 90 216 4836560 (4 Hat/Line)-173(Extention)
Fax: 00 90 216 3544941
00 90 216 4913269
Gsm: 00 90 533 6579897
00 90 533 7480014
msn: [log in to unmask]
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