New designs, materials, and applications are constantly being developed to flexible circuitry and chip scale packaging (CSP) technologies. It's essential to stay on top of these changes, and that's why IPC has assembled a lineup of industry experts to speak at the International Conference on Flexible Circuits and Chip Scale Packaging on July 24-25, 2006, in Minneapolis, Minn.
Don't miss out on this opportunity to attend one day of educational programs covering the basics of flexible circuitry, IC packaging, defect free fabrication and design.
Visit www.ipc.org/FlexNchips for a full agenda of the Conference and course descriptions. The one-day conference will take place on July 25.
Educational Courses:
July 24, 2006
The Complete Guide to Flexible Circuitry: Materials, Processes & Packaging
8:30am-4:30pm - Instructed by Ken Gilleo, Ph.D., ET-Trends LLC
Advanced Packaging Technologies and Future Trends
8:30am-11:30am - Instructed by Joe Fjelstad, Silicon Pipe, Inc.
Advanced Troubleshooting for Printed Wiring Board Manufacturing - Defect Analysis and Prevention
8:30am-11:30am - Instructed by Michael Carano, Electrochemicals, Inc.
Flexible Circuit Design Principles and Fabrication Requirements
1:00pm-4:00pm - Vern Solberg, Micro Electronic Engineering Services
Key Aspects of Desmear, Metallization and Electroplating of Flexible Circuits
1:00pm-4:00pm - Instructed by Michael Carano, Electrochemicals, Inc.
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