Register now and take advantage of these Printed Circuit Board webcasts:

July 13, 2006 - 10:00 am - 11:00 am (CDT) - Basics of Multilayer 
An overview of materials and resin systems will be provided. Multilayer
fabrication in regard to surface preparation and imaging and circuit
formation, and innerlayer treatment adhesion promotion will be explored.
Information on lamination with reference to lay-up, press cycles, post
press cycle operation and process effects due to lamination will also be
shared. 

July 20, 2006 - 10:00 am - 11:00 am (CDT) - Via Formation and
Metallization
This second webcast in the series will feature via formation with
reference to drilling basics, feeds and speeds, drill bit quality and
the effect of drilling on hole wall quality. Desmear/etchback with
reference to material concerns will also be explored. 

July 27, 2006 - 10:00 am - 11:00 am (CT) - Electroplating Technologies
The third webcast in the series will discuss electroplating technologies
(i.e., pattern and panel plating), and provide an overview of the
plating process and factors affecting plating distribution and throwing
power. Don't miss out on this opportunity to learn everything you need
to know about the electroplating process! 

Please cut and paste the following into your browser to register:
http://www.ipc.org/calendar/2006/PWB_BasicWebcastSeries_0706/PWBFab_Webc
astSeries_706.htm

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