Hi Victor - Just a comment - the 30 microinches of Pd/Ni could be a source
of a solder joint integrity issue. Tin and Pd will form an intermetallic
compound that is brittle causing solder joint failure in a similar fashion
to the gold/tin intermetallic system. You don't describe the thickness of
the Pd and of the Ni but if the Pd is much thicker than 15 microinches I
would be concern. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]




             "Victor G.
             Hernandez"
             <Victor_G_Hernand                                          To
             [log in to unmask]>              [log in to unmask]
             Sent by: Leadfree                                          cc
             <[log in to unmask]
             >                                                     Subject
                                       [LF] Au, PdAu, Ni , base metal
                                       plating
             07/12/2006 09:14
             AM


             Please respond to
                "(Leadfree
                Electronics
             Assembly Forum)"
             <[log in to unmask]
             >; Please respond
                    to
             Victor_G_Hernande
                [log in to unmask]






Fellow TechNetters:

  Can someone share their experience with the above stated process.
I am searching for desired thickness and plating sequence.
Is sequence acceptable and the use of Sn?

1. NICKEL THICKESS :50-90''
2.Sn THICKNESS:30-50''  OVER  NICKEL
3.Pd/Ni THCIKNESS:30'' OVER Sn
4. GOLD  THICKNESS:  5-7'' OVER Pd/Ni


Victor,

-------------------------------------------------------------------------------Leadfee
 Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks send:
SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-------------------------------------------------------------------------------

-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-------------------------------------------------------------------------------