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July 2006

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Subject:
From:
"SCHMIDT, WOLF-DIETER - PFHO" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 12 Jul 2006 08:44:24 +0200
Content-Type:
text/plain
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text/plain (115 lines)
Hello Werner,

thanks für that interesting data. But I've two questiions:
1.) "TE(50Ÿ260)"
What's the meaning ?  Thermal expansion in z-direction ? with "50Ÿ260"
representing the temperature range ?

2.)"STII"
What's the definition of that data ?

Regards
Wolf-Dieter

----------------------------------------------------------------------------
------------------

Wolf-Dieter Schmidt
-----------------------------------------------------------
THALES Defence Deutschland GmbH
Industrial Engineering
Land & Joint Systems
Ostendstrasse 3
D-75175 Pforzheim - Germany
-----------------------------------------------------------
Phone: +49 7231 15 3386
Fax: +49 7231 15 3390
mailto: [log in to unmask]
http://www.thalesgroup.com



> -----Original Message-----
> From: Werner Engelmaier [mailto:[log in to unmask]] 
> Sent: Tuesday, July 11, 2006 11:00 PM
> To: [log in to unmask]
> Subject: Re: [LF] Price premium for Tg = 170 Deg C?
> 
> 
> Hi,
> I have not heard that Dicy-cured materials are more CAF-prone than 
> non-Dicy-cured resins. The problem of CAF is to a large 
> degree determined by drilling 
> quality and distance between PTHs [=distance for the CAF-path 
> aling glass 
> fibers].
> In terms of CTE and Tg— the CTE's vary for either Dicy-cured or 
> non-Dicy-cured resins; it is the product of alpha-2-CTE x 
> delta-T that determines what the 
> thermal expansion mismatch is with the copper barrel——the 
> larger this product 
> the worse it is, everything else being equal. Of course, you 
> can plate more 
> and/or better Cu into the holes.
> In my white paper I have a table with STII-values [Soldering 
> Temperature I mpact Index], which clearly shows the 
> differences between many of the available 
> materials.
> 
> Table I.     Various Laminates/Prepregs with their Properties and 
> STII-Values. 
> Vendor      Designation      Tg(TMA)      Td(5%) TE(50Ÿ260)     STII
> High-End Standard Laminates
> TUC/Taiwan      TU-622-5     135°C     310°C     4.1%     181
> ISOLA     IS400     135°C     330°C     3.0%      202
> NELCO     N4000-7     150°C     330°C     3.7%     203
> Laminates with Limited Lead-Free Compatibility
> TUC/Taiwan      TU-662     145°C     340°C     3.4%     209
> ISOLA     FR250 HR     _140°C     350°C     3.4%      211
> Lead-Free Compatible Laminates
> TUC/Taiwan      TU-722     172°C     330°C     3.5%     216
> TUC/Taiwan      TU-642     _135°C     360°C     2.7%     220
> TUC/Taiwan      TU-742     140°C     370°C     3.1%     224
> ISOLA     IS410     _170°C     350°C     3.5%     225
> NELCO     N4000-11     170°C     345°C     3.2%     225
> ISOLA     FR408     _170°C     360°C     3.5%      230
> NELCO     N4000-29     175°C     350°C     3.0%     232
> TUC/Taiwan      TU-752     170°C     350°C     2.7%     233
> ISOLA     370 HR     _170°C     350°C     2.7%      233
> NELCO     N4000-12     180°C     370°C     3.6%     239
> Advanced Lead-Free Compatible Laminates
> ISOLA     IS415     _180°C     370°C     2.9%     246
> NELCO     N4000-13     200°C     365°C     3.5%     247
> TUC/Taiwan      TU-832     210°C     340°C     2.5%     250
> ISOLA     IS620     _205°C     353°C     2.8%     251
> ISOLA     IS500     _170°C     400°C     2.8%     257
> TUC/Taiwan      TU-842     _170°C     390°C     2.1%     259
> POLYCLAD     LD-621     _190°C     400°C     3.0%     260
> 
> 
> 
> Werner
> 
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