Chris,
We have run experiments using SAC 305 and have obtained fairly good
results. We got the best results at 260 F topside preheat. I think if
your flux can withstand high temperature without getting burnt, you can
increase the topside preheat even to 280 F. Your solder pot temperature
looks good. You can also probably try decreasing your conveyor speed (to
about 4 ft/min) to see if you can get better results.
Thanks.
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Friday, July 21, 2006 10:04 AM
To: [log in to unmask]
Subject: Re: [LF] [TN] SAC 305 Pb Free Wave Solder Profile Help
Hi Chris,
This might be a tangent to your original questions, but why/how did you
select SAC 305 for wave?. During our qualification runs with SAC 305, we
had extensive degree of microcracking on bottom side fillets for TH
joints on a couple of different occasions. We have not had that defect
show up in high Sn alloy (without naming names, the most common high Sn
alloy) we used instead.
Food for thought?
Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing, Inc.
941 Route 38 Owego, NY 13827
Phone: (607) 687-7669 x349
[log in to unmask]
www.harvardgrp.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Schaefer
Sent: Friday, July 21, 2006 10:39 AM
To: [log in to unmask]
Subject: [TN] SAC 305 Pb Free Wave Solder Profile Help
Hello everyone,
Its Friday yeeeeehawww! Kansas talk over here...
I am setting my first Pb Free wave soldering line and I have some
questions
concerning acheiving an Optimum profile. I am using SAC305 at 509F
(265C);
I am using 2 IR heaters (for now until more demand for Pb products come
around); I am using a foam fluxer with Kester 186-18RMA; Speedline
Ultrafill nozzles (chip and laminar); all packaged in an old cerca 94
EPK
Plus. I am currently in the certification stage where I am about to run
the
qualification vehicles that will be sent out for testing. Of course I
need
to make sure that all is well prior to soldering them, so I would like
to
get some feedback from the land of eternal knowledge. I have been
shooting
for a topside board temperature of 248F (120C) prior to hitting the wave
and I have achieved this, but the results are not very good. The test
vehicle are single sided with SMT and PTH components, and I thought I
would
achieve good solder formation on the leaded components. My question is
what
would be the maximum topside temperature I could use with degrading the
substrate and solder joints. I have run the test boards at higher
topside
temps. (287F) and get good results, but I'm concerned that it may be too
high. The flux is holding up very well duing the process, so this is not
a
problem and I believe that 509F solder bath temp. is a good start. Also,
what should be the maximum board temp. delta during the solder wave? If
any
of you have anything to offer I would very much appreciate it.
Thanks Guys and Gals
Have a great weekend...
Chris Schaefer
Suntron Corporation
Process Engineer
540 N. Rogers Road
Olathe, Kansas 66062
913.393.5878
[log in to unmask]
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