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Date: | Mon, 17 Jul 2006 18:39:15 -0700 |
Content-Type: | text/plain |
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Steve:
Beside what Tom and Edward said I would also check space between EING plated pads or fingers. Sometimes solder mask are not properly developed. A residue is prone to metallize (by Au), thus in certain condition make shorts. Check by microscope around edges of SM.
Zlatko B.
Strataflex Corporation
----- Original Message ----
From: Steve Kelly <[log in to unmask]>
To: [log in to unmask]
Sent: Friday, July 14, 2006 10:31:03 AM
Subject: [TN] Flex Circuit Voltage Failures
Good Morning,
I apologize for this long e-mail but I thought it best to try and provide as
much info as possible.
We have a customer who is experiencing voltage failures on the following
build :
S/M
.0007 Copper (pads layer)
.008 FR-4 (Isola 410)
.0007 Copper (pads layer)
.001 DuPont Acrylic adhesive (bag layer)
.001 DuPont FR Kapton (bag layer)
1080 pre-preg
.0005 DuPont kapton
.0005 DuPont Adhesive
.0007 Copper (signals)
.001 Kapton
.0007 Copper (signals)
.0005 adhesive
.0005 kapton
.0005 adhesive
.0007 copper (signals)
.001 kapton
.0007 copper (signals)
.0005 adhesive
.0005 kapton
1080 pre-preg
.001 kapton
.001 adhesive
.0007 copper (pads layer)
.008 FR-4
.0007 copper (pads layer)
S/M
Finish ENIG
Lines are .004-.005 and spaces .008.
The part is run at 75 C , 90 % RH, with 300 volts run on line 1 , 0 on line
2 etc. Failures start to occur after approx. 48 hours and we think it is
track to track.
Any thoughts or suggestions would be appreciated.
Steve Kelly
PH: (416) 750-8433
FAX: (416) 750-0016
CELL: (416) 577-8433
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