Dear Sedlak
Can you please a bit more about your new technic and chemicals which
will not need surface roughness much. My second question is that can we
use MND with our process, if yes which types of adjustments we need
Best Regards
Yusuf
R Sedlak yazmış:
>Phew... the stripping issues you generate doing this must be incredible.
>
>We had a photoresist stripper we dubbed "MND"... for "Minor Nuclear Device".
>Sounds like you would need it after this treatment...
>
>Rudy Sedlak
>RD Chemical Company
>
>Jeffrey Bush <[log in to unmask]> wrote: You can also do a 170F/15 Min bump in an oven to improve adhesion of DF to copper.
>
>Jeffrey Bush
>Director, Quality Assurance and Technical Support
>VERMONT CIRCUITS INCORPORATED
> 76 Technology Drive - POB 1890
> Brattleboro, Vermont 05302
> Voice - 802.257.4571 ext 21
> Fax - 802.257.0011
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of R Sedlak
>Sent: Thursday, July 13, 2006 10:57 AM
>To: [log in to unmask]
>Subject: Re: [TN] Surface Roughness
>
>Yusef Gimec:
>
> You bring up an interesting question. With more modern dryfilm, it has been shown unnecessary for the copper to be roughened at all... in fact there is a related industry, the photochemical machining industry, which makes lead frames, which cannot tolerate any roughening, and uses dryfilms for etching copper. We have developed cleaners for this industry, which clean the copper, but leave it shiney, and the dryfilm adheres very well.
>
> This ability to bond to a smooth surface may vary with the dryfilm, but we have yet to find a film which does not bond very well to a properly cleaned smooth surface.
>
> The key issue we find is to clean the copper, dry, and bond the dryfilm immediately, with no hold time between any of the steps.
>
> I suspect that your dryfilm supplier may be looking for excuses to blame the problems you are having, and they do not really understand the issue.
>
> Rudy Sedlak
> RD Chemical
>
>Baski Devre wrote:
> Dear Technetter
>
>To gain best bonding of dry film to the base material some of the
>parameters must be controlled strictly such as temperature of rollers of
>laminator or sodium carbonate and may be the most critical parameter is
>surface roughness. Our dry film supplier suggest roughness value for Rz
>1,5 - 3 microns for Ra 0,15 -0 ,3 microns. I want to have your comments
>if Rz is normal I mean between 1,5 and 3 microns let us say Rz is 2.10
>and Ra is 0.41 microns, how can we interprete or comment on these value;
>does it bring good bonding with it or it is an obstacke for dry film to
>bond to surface
>Thanks in advance for your interpretations and knowledge share
>Best Regards
>
>--
>Yusuf GÖMEÇ
>Product Quality Engineer
>
>
>BASKI DEVRE SAN ve TIC LTD STI
>Ceyhan Sk. No:10 34896 Pendik-Istanbul-Turkey
>Tel: 00 90 216 3901036 (4 Hat/Line)-173(Extention)
>00 90 216 4836560 (4 Hat/Line)-173(Extention)
>Fax: 00 90 216 3544941
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>00 90 533 7480014
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--
Yusuf GÖMEÇ
Product Quality Engineer
BASKI DEVRE SAN ve TIC LTD STI
Ceyhan Sk. No:10 34896 Pendik-Istanbul-Turkey
Tel: 00 90 216 3901036 (4 Hat/Line)-173(Extention)
00 90 216 4836560 (4 Hat/Line)-173(Extention)
Fax: 00 90 216 3544941
00 90 216 4913269
Gsm: 00 90 533 6579897
00 90 533 7480014
msn: [log in to unmask]
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