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Wed, 19 Jul 2006 19:35:40 EDT |
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I have not followed all the postings on this topic, but have a question
about where what standard applies.
About 5 years ago, IPC committees completed performance (6016) and materials
(4104?) standards on "microvias". In addition, there is a design guideline
(2226). The assumption, I believe, was that holes 150 microns or less, were
"microvias". These documents were stated to pertain only to the layers with
"microvias". Otherwise, 6012 pertains to the other layers. Of course, the
thought then was that sequentially added layers on the outside of a standard
core board was what the standards meant. However, there may be interpretation
that small, laser drilled internal layers also pertain.
Guess I need a clarification as to where each standard applies here in 2006.
Denny Fritz
MacDermid, Inc
*******************************
In a message dated 7/18/2006 10:07:53 P.M. Eastern Daylight Time,
[log in to unmask] writes:
Thanks Wayne and Yehuda.
Specifically, these are sequential lamination blind vias. I wanted
reaffirmation of my interpretation of 6012 internal annular ring as applied
to the different types of holes, which you have provided.
Regards,
Jay
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