http://www.epa.gov/opptintr/dfe/pubs/pwb/tech_rep/Surface_Finishing.pdf

abcd

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Roland Jaquet
Sent: Wednesday, June 07, 2006 11:51 AM
To: [log in to unmask]
Subject: [TN] Electrical test Failures on Bare Board Finsihes, in
particular OSP


Dear Technetters,

Earlier today I sent an email that for some reason got erased. I apologize.

I am wondering if there is some knowledge regarding the surface electrical
insulation / resistance depending on the type of Surface Finishes such as
for the bare PCBs as below:

#1 Electroless Nickel Immersion Gold
#2 Immersion Tin
#3 HAL Lead free
Organic Solderability/Surface Preservative
Electroplated nickel & gold
Electroless nickel immersion thick gold
Immersion Silver
Electroless  Nickel & Palladium, Immersion Gold
Hot air solder leveling
Electroless Thick Gold
SAC
(any finishes I am missing here?)

For instance, I am wondering what could be the resistance of an OSP finish
if the contact is such as a feather and flat, versus conical point digging
in?

Anyone met this kind of problem yet?

In our case, we are considering contact less Electrical Test and we worry
about the different issues we could get in with such a process!

Any suggestion?

Thank you
Best Regards
Roland

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