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June 2006

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Subject:
From:
Roland Jaquet <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Roland Jaquet <[log in to unmask]>
Date:
Wed, 7 Jun 2006 17:12:30 +0200
Content-Type:
text/plain
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text/plain (272 lines)
Thank you fro the info, but yes this is for PBA only



I may sound old fashioned, but I am looking for a management standard /
industry recognized system for Rejects and Defects for Bare PCBs.

I know the subject has been raised before and as most things, it is coming
back.

The way PCB manufacturers are calculating Rejects & Defects from what I
seen and used for many years, is not at all consistent.

Companies are more aiming on First pass Yield, but below that it is getting
blurry as for others:

Some are talking in Rejects, and not considering defects, even so we know
often the number of Defects could be double the number of Rejects.
There is Internal Defects, Customer Defects, Internal Rejects and Customer
Rejects. From what I seen, internal to Customer ratio is of about 10 to 100
times. I.e. If PCB manufacturer says he has 0.1% rejects at the customer
side, it could mean 1 to 10% Defect in production.

Now, regarding the way to value those rejects, some people are accounting
in finished product value (sold price) at any given stage of manufacturing,
and/or calculated at cost of production and material.. Now some will
eventually consider the fact that during the time they were manufacturing a
reject, they could have done a good board! Adding the re-make cost!

Same for defects, and reworks costs and so on..

Isn't there someone who was able to put some order of logic into all this?

What about reject forecasting?
- i.e. by process such as Panel Plating versus Pattern?
- Additive / semi-Additive?
- Positive / Negative Photoresist?
- Liquid versus Dry Film Resist?
- ...

Sounds to me that each manufacturer is building his own system and that
often it is ERP capable dependant, and that it also has some depth where
each one is more or less performant and accurate.

Meilleures salutations
Very Best Regards
Rol@nd

www.PCBspecialist.com
Roland Jaquet
14 Champ Budin
1258 Perly, GENEVA
Switzerland

Tel         +41-22-880-0405
Fax         +41-22-880-0409
Mobile   +41-79-203-3723

There are three constants in life...
Change, Choice and Principles.
Stephen R. Covey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Franklin D Asbell
Sent: Wednesday, June 07, 2006 4:17 PM
To: [log in to unmask]
Subject: Re: [TN] How are PCB & Assembly manufacturers measuring scrap?

The work and documents seem more focused on assembly rather than bare board
calculations. Is there work being done on bare board rejects?

Franklin

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski
Sent: Wednesday, June 07, 2006 9:01 AM
To: [log in to unmask]
Subject: Re: [TN] How are PCB & Assembly manufacturers measuring scrap?

See the link

http://www.ipc.org/committeedetail.asp?Committee=5-22G

Rich K / KEDS
260.925.8719

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Franklin D Asbell
Sent: Tuesday, June 06, 2006 2:53 PM
To: [log in to unmask]
Subject: Re: [TN] How are PCB & Assembly manufacturers measuring scrap?

Technical Committee 5-22G??? Which one is this?

Franklin

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roland Jaquet
Sent: Tuesday, June 06, 2006 12:14 PM
To: [log in to unmask]
Subject: Re: [TN] How are PCB & Assembly manufacturers measuring scrap?

Dear Jack,

Thanks to Denny I learn there is an IPC committee 5-22G in regards to
Production scrap (Rejects) and this subject is of acute interest to me
as I
believe there is some major flows in Bare Board Manufacturing
measurement
of Defect and Rejects.

I do not know how to get information on what has been done and what I
could
read in order to follow the path of the wise men..

I seek to make measurements of Rejects and Defects at the Electrical
Test
level (keeping in mind we are on Bare Boards).

I would appreciate your help as I would appreciate anyone's input as
well.

Thank you very much

PS I am a member of EIPC

Regards to Denny, and thank you.

Meilleures salutations
Very Best Regards
Rol@nd

www.PCBspecialist.com
Roland Jaquet
14 Champ Budin
1258 Perly, GENEVA
Switzerland

Tel         +41-22-880-0405
Fax         +41-22-880-0409
Mobile   +41-79-203-3723

There are three constants in life...
Change, Choice and Principles.
Stephen R. Covey


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dennis Fritz
Sent: Thursday, April 20, 2006 4:18 AM
To: [log in to unmask]
Subject: Re: [TN] How are PCB & Assembly manufacturers measuring scrap?

The assembly side PWB manufacture has worked hard to quanify  yield in
terms
of "defects per million opportunities - DPMO".   While  this is not
actually a
measure of scrap, this does even out differences between  simple and
complex
assemblies

Recently, the same group has started to try to quanify board  fab in
some
similar terms to DPMO.   Board fabrication is not so  easy to quantify
as
it is
harder to define an individual "opportunity".

At Apex/Expo time, this group was collecting the defect codes  from
several
board fabrication shops to try to get a feel for some metrics the
committee
could track.  Anyone interested should contact IPC Committee  5-22G
under
Greg
Hurst of BAE Systems or IPC Technical Staff LIason Jack  Crawford, as a
start.

Denny Fritz
MacDermid, Inc

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