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June 2006

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Subject:
From:
Gerald Gagnon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gerald Gagnon <[log in to unmask]>
Date:
Mon, 5 Jun 2006 18:01:47 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (189 lines)
Rats,

I deleted Jeff Bush's responses and others, so I will respond to Victor.

What Jeffrey says regarding VAC PAC is true, but.......

In the lead free world we are using a solder (SAC305 I presume) that is not
as good at wetting/spreading compared to what we are used to (SnPb). It
works though (reliability concerns aside).

We compound that by using surface finishes that also do not wet as well as
what we are used to (HASL). They work too.

I tend to favor treating all RoHS surface finishes with respect by keeping
the surfaces as pristine as possible without getting ridiculous about it. I
don't think separators (special ones for ImAg) are ridiculous.

What about the contact with the bag? I'm more concerned with plasticizers
and any type of transferrable "organic" exudate from the plastic in
hot/humid locales. This does happen.

So, when I am faced with solderability "issues", eliminating the possibility
of packaging as a source helps move things along a bit faster towards the
solution...

Regards,

Gerry





From: "Victor G. Hernandez" <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
[log in to unmask]
To: [log in to unmask]
Subject: Re: [TN] Packaging requirements for IAg Finished PWBs
Date: Mon, 5 Jun 2006 06:59:59 -0500

What can occur if IMAg silver surface finishes touch each other and/or
the bag.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gerald Gagnon
Sent: Saturday, June 03, 2006 10:40 AM
To: [log in to unmask]
Subject: Re: [TN] Packaging requirements for IAg Finished PWBs

Jeffery,

Oops. disagree with you here.... ImAg surfaces must never touch while in
the
package nor should they touch the bag..

I'd be more than willing to pay for this. Can we trade the cost for
leaving
out the useless desiccant?

Gerry


From: Jeffrey Bush <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,              Jeffrey
Bush
<[log in to unmask]>
To: [log in to unmask]
Subject: Re: [TN] Packaging requirements for IAg Finished PWBs
Date: Fri, 2 Jun 2006 11:42:35 -0400

Recommend VAC PAC with not interleaving.  Interleaving is and added cost
that is not needed as the boards are held tight in the VAC PAC.

Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
             76 Technology Drive - POB 1890
                Brattleboro, Vermont 05302
                  Voice - 802.257.4571 ext 21
                      Fax - 802.257.0011
                         <http://www.vtcircuits.com/>

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Camac
Sent: Thursday, June 01, 2006 10:47 AM
To: [log in to unmask]
Subject: [TN] Packaging requirements for IAg Finished PWBs

Good morning all,

I am struggling through a rewrite of our material specification for
PWBs.  I
have seen the recommendation that cover sheets and interleaf sheets
should
be used to prevent scratches on IAg finished PWBs.  Have those that are
using IAg seen this as necessary?  We eliminated this requirement on
Sn/Pb
finished PWBs some time ago without any negative effects.

Thanks,

Gary Camac

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