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June 2006

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Subject:
From:
Daniel Blass <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Daniel Blass <[log in to unmask]>
Date:
Mon, 5 Jun 2006 09:59:25 -0500
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Since it is my area of research, I'd say this is the place to consider flip
chip.  We have helped several automotive suppliers with flip chip on board.
 Flip chip assembly can be integrated with the standard SMT process and give
a much smaller foot print than a leaded device or standard pitch BGAs.

However, the process knowledge required is a barrier to implementing FC.
Board cost is higher since it requires very small substrate features and
good tolerances.  Since all the decisions are the assembler's
responsibility, it is much more involved than selecting a BGA package.
Depending on your volumes and future needs, it may or may not make sense to
use flip chip on board.

Most of our research isn't publicly available but if you are interested in
FC for harsh environments, you can look at some of the work published by
Wayne Johnson's group at Auburn.

Regards,
Daniel Blass
Process Research Engineer
Area Array Consortium
Surface Mount Technology Lab
Universal Instruments Corporation
http://www.uic.com/wcms/WCMS2.nsf/index/Global_Svc_Support_31.html

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