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Date: | Sun, 4 Jun 2006 08:46:33 EDT |
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Hi Gerry,
Automotive electronics, particularly under-hood, are operating in some of the
most severe environments for electronics. As such, designs that would be
perfectly reliable in other operating conditions may fail prematurely in this
environment. Thus, proper Design-for-Reliability (DfR) is more challenging for
automotive applications than for applications like telecommunications or
computers. And, of course, this has not been made easier with the forced change to
lead-free solders—the automotive exemption is unfortunately an unrealistic
illusion.
There is no reason to avoid BGAs in automotive use, but the larger they get
the more challenging DfR will be.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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