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June 2006

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Sun, 4 Jun 2006 08:46:33 EDT
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Hi Gerry,
Automotive electronics, particularly under-hood, are operating in some of the 
most severe environments for electronics. As such, designs that would be 
perfectly reliable in other operating conditions may fail prematurely in this 
environment. Thus, proper Design-for-Reliability (DfR) is more challenging for 
automotive applications than for applications like telecommunications or 
computers. And, of course, this has not been made easier with the forced change to 
lead-free solders—the automotive exemption is unfortunately an unrealistic 
illusion.
There is no reason to avoid BGAs in automotive use, but the larger they get 
the more challenging DfR will be.  

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com

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