Hi-
We're an automotive company using BGA's. They are not common in our
applications at this point, but not verbotten. A recent prototype uses 0.5
mm pitch, but may switch to 1mm for production.
It's a combination of associated cost factors (in this case, maybe higher
layer count, micro-vias, etc.), relative product complexity (we aren't
usually on the bleeding edge so don't NEED it), and fear of the new (no
historical reliability data), that slow down the introduction of any new
technology in automotive electronics. We didn't jump all over SMT either,
and took MANY years to fully embrace the concept.....
Because the environment is so harsh, and long term reliability issues are
SOOOOO serious, we will proceed with great caution.
BR,
-Chris
Gerald Gagnon
<[log in to unmask] To: [log in to unmask]
> cc:
Sent by: TechNet Subject: [TN] Use of BGA packaging in automotive
<[log in to unmask]> applications
06/03/2006 12:25 PM
Please respond to TechNet
E-Mail Forum; Please
respond to Gerald Gagnon
All,
I was recently told that BGA packages are not reliable enough for
automotive
applications. I know automotive environments are harsh & hot, but I found
that statement to be the type to challenge.
Are BGA packages used successfully in automotive applications?
If so, what types of BGA packages are preferred?
Any pitch or pincount limits?
Discussions welcome.
Gerry
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