Jeffery,

Oops. disagree with you here.... ImAg surfaces must never touch while in the
package nor should they touch the bag..

I'd be more than willing to pay for this. Can we trade the cost for leaving
out the useless desiccant?

Gerry


From: Jeffrey Bush <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,              Jeffrey Bush
<[log in to unmask]>
To: [log in to unmask]
Subject: Re: [TN] Packaging requirements for IAg Finished PWBs
Date: Fri, 2 Jun 2006 11:42:35 -0400

Recommend VAC PAC with not interleaving.  Interleaving is and added cost
that is not needed as the boards are held tight in the VAC PAC.

Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
            76 Technology Drive - POB 1890
               Brattleboro, Vermont 05302
                 Voice - 802.257.4571 ext 21
                     Fax - 802.257.0011
                        <http://www.vtcircuits.com/>

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Camac
Sent: Thursday, June 01, 2006 10:47 AM
To: [log in to unmask]
Subject: [TN] Packaging requirements for IAg Finished PWBs

Good morning all,

I am struggling through a rewrite of our material specification for
PWBs.  I
have seen the recommendation that cover sheets and interleaf sheets
should
be used to prevent scratches on IAg finished PWBs.  Have those that are
using IAg seen this as necessary?  We eliminated this requirement on
Sn/Pb
finished PWBs some time ago without any negative effects.

Thanks,

Gary Camac

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