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June 2006

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Wed, 28 Jun 2006 16:02:33 -0700
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text/plain (112 lines)
Actually I just noticed doesn't this description "planar array ceramic
multilayer capacitors." Describe any SMT cap?

John

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, June 28, 2006 3:54 PM
To: [log in to unmask]
Subject: Re: [TN] Draft exemptions additions

Um........it was Monday??

John

-----Original Message-----
From: Ahne Oosterhof [mailto:[log in to unmask]]
Sent: Wednesday, June 28, 2006 2:20 PM
To: 'TechNet E-Mail Forum'; 'John Burke'
Subject: RE: [TN] Draft exemptions additions

And what was the "technical" background reason for these exemptions? Most
curious about that for numbers 23 and 24.

Ahne.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, 28 June, 2006 11:09
To: [log in to unmask]
Subject: [TN] Draft exemptions additions

Here is the draft of the exemptions list that was approved by the TAC on
their meeting this week. It is draft so presumably not yet written in stone:



John



ANNEX

In the Annex to Directive 2002/95/EC the following points 21 to 27 are
added:

"21. Lead and cadmium in printing inks for the application of enamels on
borosilicate glass.

22. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used
for fibre optic communications systems.

23. Lead in finishes of fine pitch components other than connectors with a
pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine
pitch components other than connectors with a pitch of 0.65 mm or less with
copper lead-frames.

24. Lead in solders for the soldering to machined through hole discoidal and
planar array ceramic multilayer capacitors.

25. Lead oxide in plasma display panels (PDP) and surface conduction
electron emitter displays (SED) used in structural elements; notably in the
front and rear glass dielectric layer, the bus electrode, the black stripe,
the address electrode, the barrier ribs, the seal frit and frit ring as well
as in print pastes.

26. Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.

27. Lead alloys as solder for transducers used in high-powered (designated
to operate for several hours at acoustic power levels of 125 dB SPL and
above) loudspeakers."




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