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June 2006

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Subject:
From:
"Chezhian, Krishnan (Radhakrishnan)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Chezhian, Krishnan (Radhakrishnan) <[log in to unmask]>
Date:
Fri, 23 Jun 2006 08:30:46 +0800
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text/plain
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text/plain (69 lines)
You could bake at the normal bake temperature to drive moisture that is
120C for 2 to 4 hours depending on the amount of moisture. But the key
to baking Immersion Tin or Silver boards is you must wrap them in
aluminum foil to prevent direct exposure of the boards to the oven
environment as sulphur is the biggest killer which would tarnish the
surface when in direct contact. 
Also make sure the boards are not baked in the soldermask curing oven as
the solvent in the oven would contaminate the surface.......

Thanks & Best Regards,
Krishnan C
SANMINA-SCI


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
Sent: Friday, June 23, 2006 2:15 AM
To: [log in to unmask]
Subject: [TN] moisture and Immersion Silver / Tin boards

The humidity has arrived, and been around long enough to generate
concerns
about moisture content in PWBs for Pb-Free soldering.

Is there a bake cycle  recipe that will drive moisture out of PWBs
without
compromising the solder performance of surface finishes like Immersion
Tin
or Immersion Silver?

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