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June 2006

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Subject:
From:
Gerald Gagnon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gerald Gagnon <[log in to unmask]>
Date:
Thu, 22 Jun 2006 16:03:22 -0400
Content-Type:
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text/plain (50 lines)
Guy,

MacDermid provides guidelines for doing this. You can reach them from their
web site. I be surpirsed if the other suppliers of immersion silver do not
have similar information.

Gerry


From: Guy Ramsey <[log in to unmask]>
Reply-To: [log in to unmask]
To: [log in to unmask]
Subject: [TN] moisture and Immersion Silver / Tin boards
Date: Thu, 22 Jun 2006 14:14:46 -0400

The humidity has arrived, and been around long enough to generate concerns
about moisture content in PWBs for Pb-Free soldering.

Is there a bake cycle  recipe that will drive moisture out of PWBs without
compromising the solder performance of surface finishes like Immersion Tin
or Immersion Silver?

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