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June 2006

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Subject:
From:
Richard Kraszewski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Kraszewski <[log in to unmask]>
Date:
Thu, 22 Jun 2006 14:03:41 -0500
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If you have a limited number of boards, the ideal way to do this quickly
is to use a vacuum oven. I forgot all the details but know that if you
pull a vacuum down to ~20mmHg, you can get the boiling point of water
down to about 15degC.  If you bake @ about 50 degC, you shouldn't have
to pull too much of a vacuum at all .  The relationship is non-linear,
however. 

Rich K / KEDS


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
Sent: Thursday, June 22, 2006 2:15 PM
To: [log in to unmask]
Subject: [TN] moisture and Immersion Silver / Tin boards

The humidity has arrived, and been around long enough to generate
concerns
about moisture content in PWBs for Pb-Free soldering.

Is there a bake cycle  recipe that will drive moisture out of PWBs
without
compromising the solder performance of surface finishes like Immersion
Tin
or Immersion Silver?

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