Two experiences were shared with  me and would like them to be
known for comments. In one instance a COTS BGA  was used on a prototype.
It would not wet to SN63Pb37 after several attempts and profile
temperature  increments It was found out that it had SAC 305 balls. Has
anyone experienced that SAC does not wet well with eutectic tin lead
solder paste? In another instance balls from SAC and Tin Lead were found
in the same BGA. Apparently solder balls were inadvertently mixed.
        Ramon

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